Robert E. Geer

According to our database, Robert E. Geer authored at least 8 papers between 2007 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Fault localization in a 3D test assembly using voltage contrast imaging.

Robert Carroll, Robert E. Geer

Microelectron. J., 2019

2015

An extendable multi-purpose 3D neuromorphic fabric using nanoscale memristors.

Harika Manem, Karsten Beckmann, Min Xu, Robert Carroll, Robert E. Geer, Nathaniel C. Cady

Proceedings of the 2015 IEEE Symposium on Computational Intelligence for Security and Defense Applications, 2015

2012

Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits.

Benjamin Backes, Colin McDonough, Larry Smith, Wei Wang, Robert E. Geer

J. Electron. Test., 2012

Plenary speaker: Connectivity driven systems: On-chip, off-chip and in-between.

Robert E. Geer

Proceedings of the IEEE 25th International SOC Conference, 2012

2011

Controlling Interfacial Adhesion of Self-Assembled Polypeptide Fibrils for Novel Nanoelectromechanical System (NEMS) Applications.

Narender Rana, Christopher Kossow, Eric T. Eisenbraun, Robert E. Geer, Alain E. Kaloyeros

Micromachines, 2011

2010

Electrical characterization of RF TSV for 3D multi-core and heterogeneous ICs.

Le Yu, Haigang Yang, Tom T. Jing, Min Xu, Robert E. Geer, Wei Wang

Proceedings of the 2010 International Conference on Computer-Aided Design, 2010

2009

Monolithic Graphene Nanoribbon Electronics for Interconnect Performance Improvement.

Sansiri Tanachutiwat, Shuhong Liu, Robert E. Geer, Wei Wang

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2009), 2009

2007

Conformational Molecular Switches for Post-CMOS Nanoelectronics.

Alain E. Kaloyeros, Mircea R. Stan, Barry Arkles, Robert E. Geer, Eric T. Eisenbraun, James E. Raynolds, Anand Gadre, Yongqiang Xue, James Ryan

IEEE Trans. Circuits Syst. I Regul. Pap., 2007