Richard Chou

According to our database, Richard Chou authored at least 2 papers between 2019 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited).

Giuliano Sisto, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic

Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2021

2019

Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route.

Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019