Richard B. R. van Silfhout

According to our database1, Richard B. R. van Silfhout authored at least 8 papers between 2004 and 2010.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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PhD thesis 
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Links

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Bibliography

2010
Prediction of the epoxy moulding compound aging effect on package reliability.
Microelectron. Reliab., 2010

2007
Molecular simulation on the material/interfacial strength of the low-dielectric materials.
Microelectron. Reliab., 2007

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.
Microelectron. Reliab., 2007

Virtual qualification of moisture induced failures of advanced packages.
Microelectron. Reliab., 2007

2006
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectron. Reliab., 2006

2005
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectron. Reliab., 2005

2004
Prediction of crack growth in IC passivation layers.
Microelectron. Reliab., 2004

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.
Microelectron. Reliab., 2004


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