Ren-Shin Cheng

According to our database, Ren-Shin Cheng authored at least 2 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology.

Tao-Chih Chang, Chang-Chun Lee, Chia-Ping Hsieh, Sheng-Che Hung, Ren-Shin Cheng

Microelectron. Reliab., 2015

2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013