Ren-Jie Lee
According to our database1,
Ren-Jie Lee
authored at least 7 papers
between 2007 and 2013.
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Bibliography
2013
IEEE Trans. Very Large Scale Integr. Syst., 2013
A study of row-based area-array I/O design planning in concurrent chip-package design flow.
ACM Trans. Design Autom. Electr. Syst., 2013
2011
Efficient Package Pin-Out Planning With System Interconnects Optimization for Package-Board Codesign.
IEEE Trans. Very Large Scale Integr. Syst., 2011
Proceedings of the Design, Automation and Test in Europe, 2011
Proceedings of the 16th Asia South Pacific Design Automation Conference, 2011
2009
IEEE Trans. Very Large Scale Integr. Syst., 2009
2007
Fast Flip-Chip Pin-Out Designation Respin by Pin-Block Design and Floorplanning for Package-Board Codesign.
Proceedings of the 12th Conference on Asia South Pacific Design Automation, 2007