Réjean Fontaine
Orcid: 0000-0002-5453-0168
According to our database1,
Réjean Fontaine
authored at least 18 papers
between 2010 and 2024.
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Bibliography
2024
CoRR, 2024
Design and Implementation of a Low-Power Low-Noise Biopotential Amplifier in 28 nm CMOS Technology with a Compact Die-Area of 2500 μm<sup>2</sup>.
CoRR, 2024
2023
IEEE Trans. Circuits Syst. I Regul. Pap., September, 2023
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2023
2022
Preliminary Results from a 49-Channel Neural Recording ASIC with Embedded Spike Compression in 28 nm CMOS.
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022
Preliminary Results of a Low-Power Wireless Telemetry Module For Long-Term µECoG Recordings.
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022
2021
3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works.
Sensors, 2021
IEEE J. Solid State Circuits, 2021
2020
CoRR, 2020
2017
A Low-Cost Time-Correlated Single Photon Counting System for Multiview Time-Domain Diffuse Optical Tomography.
IEEE Trans. Instrum. Meas., 2017
Proceedings of the 15th IEEE International New Circuits and Systems Conference, 2017
2016
Preliminary results of a low-cost 4-channel time-correlated single photon counting system for time-domain diffuse optical tomography.
Proceedings of the 2016 IEEE International Symposium on Medical Measurements and Applications, 2016
2015
A 10-Bit, 12 ps Resolution CMOS Time-to-Digital Converter Dedicated to Ultra-Fast Optical Timing Applications.
Circuits Syst. Signal Process., 2015
2014
Automatic Channel Fault Detection and Diagnosis System for a Small Animal APD-Based Digital PET Scanner.
CoRR, 2014
A 10-bit, 3 ps rms precision time-to-digital converter for diffuse optical tomography measurements.
Proceedings of the 21st IEEE International Conference on Electronics, Circuits and Systems, 2014
2010
Proceedings of the IEEE International Conference on 3D System Integration, 2010