Rao R. Tummala

According to our database, Rao R. Tummala authored at least 12 papers between 1991 and 2018.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2018

Miniaturized and high-performance RF packages with ultra-thin glass substrates.

Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala

Microelectron. J., 2018

2017

System Scaling With Nanostructured Power and RF Components.

Markondeya Raj Pulugurtha, Himani Sharma, Srikrishna Sitaraman, Dibyajat Mishra, Rao R. Tummala

Proc. IEEE, 2017

2014

Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.

Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.

Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman

Microelectron. Reliab., 2013

Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.

Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2009

Trend from ICs to 3D ICs to 3D systems.

Rao R. Tummala, Venky Sundaram, Ritwik Chatterjee, P. Markodeya Raj, Nitesh Kumbhat, Vijay Sukumaran, Vikay Sridharan, Abhishek Choudury, Qiao Chen, Tapobrata Bandyopadhyay

Proceedings of the IEEE Custom Integrated Circuits Conference, 2009

Electrical modeling of Through Silicon and Package Vias.

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2004

Gigabit wireless: system-on-a-package technology.

Rao R. Tummala, Joy Laskar

Proc. IEEE, 2004

1999

System on Chip or System on Package?

Rao R. Tummala, Vijay K. Madisetti

IEEE Des. Test Comput., 1999

1992

Multichip packaging-a tutorial.

Rao R. Tummala

Proc. IEEE, 1992

High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.

Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond

IBM J. Res. Dev., 1992

1991

High Performance Packaged Electronics for the IBM ES9000^TM Mainframe.

Arnold E. Barish, James P. Eckhardt, Mark D. Mayo, Walter A. Svarczkopf, Santosh P. Gaur, Rao R. Tummala

Proceedings of the Proceedings 1991 IEEE International Conference on Computer Design: VLSI in Computer & Processors, 1991