Rajendaran Vairavan

According to our database, Rajendaran Vairavan authored at least 4 papers in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of six.

2013

High Power LED Thermal and Stress Simulation on Copper Slug.

Rajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Rizalafande Che Ismail, Nurul Izza Mohd Nor, Nor Shakirina Nadzri, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Stress and Temperature Simulation Using Copper-Diamond Composite Slug.

Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Rizalafande Che Ismail, Nazuhusna Khalid, Mohd Fikri Che Husin, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power.

Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Wan Mokhdzani Wan Nor Haimi, Hussin Kamarudin, Neoh Fung Yih, Nazuhusna Khalid

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED.

Rajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Phaklen EhKan, Ong Tee Say

Proceedings of the Asia Modelling Symposium 2013, 2013