Rainer Dudek

According to our database1, Rainer Dudek authored at least 9 papers between 2007 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2018
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue.
Microelectron. Reliab., 2018

2014
Investigation on thermal fatigue of SnAgCu, Sn100C, and SnPbAg solder joints in varying temperature environments.
Microelectron. Reliab., 2014

On the crack and delamination risk optimization of a Si-interposer for LED packaging.
Microelectron. Reliab., 2014

2013
Effect of moisture swelling on MEMS packaging and integrated sensors.
Microelectron. Reliab., 2013

2012
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests.
Microelectron. Reliab., 2012

Studies on the reliability of power packages based on strength and fracture criteria.
Microelectron. Reliab., 2012

2009
Simulation based analysis of secondary effects on solder fatigue.
Microelectron. Reliab., 2009

2008
An approach of numerical multi-objective optimization in stacked packaging.
Microelectron. Reliab., 2008

2007
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
Microelectron. Reliab., 2007


  Loading...