Rachid Taibi

According to our database, Rachid Taibi authored at least 3 papers between 2009 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2012

Low temperature direct bonding: An attractive technique for heterostructures build-up.

H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, Luc Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet

Microelectron. Reliab., 2012

2011

200°C direct bonding copper interconnects : Electrical results and reliability.

Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.

Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier

Proceedings of the IEEE International Conference on 3D System Integration, 2009