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R. Wayne Johnson

According to our database1, R. Wayne Johnson authored at least 2 papers between 2011 and 2015.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Awards

IEEE Fellow

IEEE Fellow 2004, "For contributions to electronics that must operate in harsh environments.".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2015
Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials.
[BibTeX]
[DOI]
Chandan K. Roy
,
Sushil Bhavnani
,
Michael C. Hamilton
,
R. Wayne Johnson
,
Roy W. Knight
,
Daniel K. Harris
Microelectron. Reliab., 2015

2011
Packaging Technology for Electronic Applications in Harsh High-Temperature Environments.
[BibTeX]
[DOI]
Ping Hagler
,
Phillip Henson
,
R. Wayne Johnson
IEEE Trans. Ind. Electron., 2011


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