R. T. H. Rongen

According to our database, R. T. H. Rongen authored at least 3 papers between 2011 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2014

Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core.

Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou

Microelectron. Reliab., 2014

Reliability of Wafer Level Chip Scale Packages.

R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage

Microelectron. Reliab., 2014

2011

Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality.

R. T. H. Rongen, A. van IJzerloo, C. Cotofana, K. M. Lan

Microelectron. Reliab., 2011