R. Kasim

According to our database, R. Kasim authored at least 4 papers between 2018 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

A Novel Approach for Assessing Impact of Temperature Hot-Spots on Chip-Package Interaction Reliability.

R. Aggarwal, L. Jiang, S. Patra, N. Lajo, Enamul Kabir, R. Kasim

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2020

Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process.

Cheyun Lin, Uygar E. Avci, M. A. Blount, Rohit Grover, Jeffery Hicks, R. Kasim, A. Kundu, C. M. Pelto, C. Ryder, Anthony Schmitz, K. Sethi, D. Seghete, D. J. Towner, A. J. Welsh, J. Weber, C. Auth

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

A Reliability Overview of Intel's 10+ Logic Technology.

Rohit Grover, Tony Acosta, C. AnDyke, Emre Armagan, C. Auth, Sunny Chugh, K. Downes, M. Hattendorf, N. Jack, S. Joshi, R. Kasim, Gerald S. Leatherman, S.-H. Lee, C.-Y. Lin, A. Madhavan, H. Mao, A. Lowrie, G. Martin, G. McPherson, Pinakpani Nayak, Adam Neale, D. Nminibapiel, Benjamin Orr, James Palmer, C. M. Pelto, S. S. Poon, I. Post, Tanmoy Pramanik, Anisur Rahman, Stephen Ramey, Norbert Seifert, K. Sethi, Anthony Schmitz, H. Wu, A. Yeoh

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018

Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology.

F. Griggio, James Palmer, F. Pan, N. Toledo, Anthony Schmitz, Ilan Tsameret, R. Kasim, Gerald S. Leatherman, Jeffery Hicks, A. Madhavan, J. Shin, J. Steigerwald, A. Yeoh, C. Auth

Proceedings of the IEEE International Reliability Physics Symposium, 2018