R. Estevez

According to our database1, R. Estevez authored at least 2 papers in 2017.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2017
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications.
Microelectron. Reliab., 2017

Structural optimization under overhang constraints imposed by additive manufacturing technologies.
J. Comput. Phys., 2017


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