R. Eisele

According to our database, R. Eisele authored at least 3 papers between 1995 and 2018.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2018

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates.

Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok

Microelectron. Reliab., 2018

2017

Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects.

Mads Brincker, S. Söhl, R. Eisele, Vladimir N. Popok

Microelectron. Reliab., 2017

1995

Decision support for the economic evaluation of systems integration.

R. Eisele, C. Hausen, T. Schwan

Proceedings of the Third European Conference on Information Systems, 1995