R. Chukka

According to our database, R. Chukka authored at least 1 paper in 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias.

P. Zhao, Liesbeth Witters, Anne Jourdain, Michele Stucchi, Nicolas Jourdan, J. W. Maes, H. Bana, C. Zhu, R. Chukka, F. Sebaai, Kevin Vandersmissen, N. Heylen, D. Montero, S. Wang, K. D'Have, F. Schleicher, J. De Vos, Gerald Beyer, A. Miller, Eric Beyne

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024