R. Bonda

According to our database, R. Bonda authored at least 1 paper in 2012.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2012

High-lead flip chip bump cracking on the thin organic substrate in a module package.

J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear

Microelectron. Reliab., 2012