R. A. B. Engelen

According to our database, R. A. B. Engelen authored at least 3 papers between 2007 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Prediction of the epoxy moulding compound aging effect on package reliability.

Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout

Microelectron. Reliab., 2010

2009

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics.

Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang

Microelectron. Reliab., 2009

2007

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.

Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils

Microelectron. Reliab., 2007