Qiushi Kang

According to our database, Qiushi Kang authored at least 3 papers between 2020 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Cooperative surface-activation strategy for low-temperature Cu/SiO2 hybrid bonding.

Qiushi Kang, Ge Li, Fanfan Niu, Chenxi Wang

Proceedings of the 2022 IEEE International Conference on Integrated Circuits, 2022

2021

Moiré-Based Nanoprecision Bonding Alignment System for Hybrid Integration.

Xiaoyun Qi, Han Yan, Shicheng Zhou, Qiushi Kang, Chenxi Wang

Proceedings of the 2021 IEEE International Conference on Integrated Circuits, 2021

2020

Low-temperature direct and indirect bonding using plasma activation for 3D integration.

Shicheng Zhou, Xiaoyun Qi, Qiushi Kang, Chenxi Wang

Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020