Qianwen Chen
Orcid: 0000-0001-7697-8919
According to our database1,
Qianwen Chen
authored at least 18 papers
between 2010 and 2023.
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Bibliography
2023
Hazard Identification and Risk Assessment of Intelligent Robots Based on Virtual Reality.
Proceedings of the Advances in Artificial Intelligence, Big Data and Algorithms - Proceedings of the 3rd International Conference on Artificial Intelligence, Big Data and Algorithms (CAIBDA 2023), 2023
2022
Signal Process., 2022
2021
IEEE Trans. Instrum. Meas., 2021
Research on Interactive Experience Design of Peripheral Visual Interface of Autonomous Vehicle.
Proceedings of the Human-Computer Interaction. Design and User Experience Case Studies, 2021
Research on Interactive Experience Design of Peripheral Visual Interface of Unmanned Logistics Vehicle.
Proceedings of the Human-Computer Interaction. Interaction Techniques and Novel Applications, 2021
2020
Optimised two-dimensional orthogonal matching pursuit algorithm via singular value decomposition.
IET Signal Process., 2020
Proceedings of the ICAAI 2020: The 4th International Conference on Advances in Artificial Intelligence, 2020
Research on Evaluation of Perceptual Experience Quality of Web-Based Panoramic Navigation System Based on Cognitive Mechanism.
Proceedings of the Human-Computer Interaction. Design and User Experience, 2020
Research on Evaluation Index System of Artificial Intelligence Design Based on User Experience.
Proceedings of the Human-Computer Interaction. Design and User Experience, 2020
2019
Analysis on the Benefits and Influencing Factors of Adopting Standards in Enterprise Level.
Proceedings of the 5th International Conference on Industrial and Business Engineering, 2019
Research on the Attention Degree to Textile Apparel Information Based on Consumer Endowments.
Proceedings of the 2nd International Conference on Computing and Big Data, 2019
2018
Proceedings of the 4th International Conference on Communication and Information Processing, 2018
2015
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectron. Reliab., 2014
2013
Microelectron. Reliab., 2013
2012
Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs).
Microelectron. Reliab., 2012
2010
Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network.
Proceedings of the IEEE International Conference on 3D System Integration, 2010