Pushparajah Rajaguru

According to our database, Pushparajah Rajaguru authored at least 7 papers between 2015 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module.

Pushparajah Rajaguru, Tim Tilford, Chris Bailey, Stoyan Stoyanov

IEEE Access, 2024

2019

Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications.

Fateme Dinmohammadi, David Flynn, Chris Bailey, Michael G. Pecht, Chunyan Yin, Pushparajah Rajaguru, Valentin Robu

IEEE Access, 2019

2018

Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables.

Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, Florin Udrea

Microelectron. Reliab., 2018

2017

Evaluation of SiC Schottky Diodes Using Pressure Contacts.

Jose Angel Ortiz Gonzalez, Olayiwola Alatise, Attahir Murtala Aliyu, Pushparajah Rajaguru, Alberto Castellazzi, Li Ran, Philip Mawby, Chris Bailey

IEEE Trans. Ind. Electron., 2017

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.

Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise

Microelectron. Reliab., 2017

2015

A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.

Pushparajah Rajaguru, Hua Lu, Chris Bailey

Microelectron. Reliab., 2015

Sintered silver finite element modelling and reliability based design optimisation in power electronic module.

Pushparajah Rajaguru, Hua Lu, Chris Bailey

Microelectron. Reliab., 2015