Pradeep Lall
Orcid: 0000-0002-4074-937X
According to our database1,
Pradeep Lall
authored at least 18 papers
between 2007 and 2024.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 2012, "For contributions to reliability prediction for electronic packaging".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2024
Cell Lifetime Degradation Model Development for Li-Ion Coin Cells considering Calendar Aging and Post-Knee Degradation (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2024
2023
Estimation of SOH Degradation of Coin Cells Subjected to Accelerated Life Cycling with Randomized Cycling Depths and C-Rates.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
2018
Proceedings of the IEEE International Reliability Physics Symposium, 2018
Prognostics health management of electronic systems - A reliability physics approach.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
2016
Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging.
Microelectron. Reliab., 2016
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature.
Microelectron. Reliab., 2016
Prognostication of remaining useful-life for flexible batteries in foldable wearable electronics.
Proceedings of the IEEE International Conference on Prognostics and Health Management, 2016
ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments.
Proceedings of the IEEE International Conference on Prognostics and Health Management, 2016
2015
Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging.
IEEE Access, 2015
Prognostication of LED remaining useful life and color stability in the presence of contamination.
Proceedings of the 2015 IEEE Conference on Prognostics and Health Management, 2015
Prognostication of solder-joint reliability of 0.4mm and 0.5mm pitch bgas subjected to mechanical shocks up to 10, 000G.
Proceedings of the 2015 IEEE Conference on Prognostics and Health Management, 2015
2012
Extended Kalman Filter Models and Resistance Spectroscopy for Prognostication and Health Monitoring of Leadfree Electronics Under Vibration.
IEEE Trans. Reliab., 2012
Decorrelated Feature Space and Neural Nets Based Framework for Failure Modes Clustering in Electronics Subjected to Mechanical Shock.
IEEE Trans. Reliab., 2012
Prognostics Health Management of Electronic Systems Under Mechanical Shock and Vibration Using Kalman Filter Models and Metrics.
IEEE Trans. Ind. Electron., 2012
2011
Prognostication of Residual Life and Latent Damage Assessment in Lead-Free Electronics Under Thermomechanical Loads.
IEEE Trans. Ind. Electron., 2011
2009
Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads.
Microelectron. Reliab., 2009
2007
Feature extraction and damage-precursors for prognostication of lead-free electronics.
Microelectron. Reliab., 2007