Poi-Siong Teo

According to our database, Poi-Siong Teo authored at least 1 paper in 2004.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2004

Thermo-mechanical finite element analysis in a multichip build up substrate based package design.

Xiaowu Zhang, Ee-Hua Wong, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath

Microelectron. Reliab., 2004