Po-Yao Chuang

According to our database1, Po-Yao Chuang authored at least 12 papers between 2016 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2024
IEEE Std P3405: New Standard-under-Development for Chiplet Interconnect Test and Repair.
Proceedings of the 42nd IEEE VLSI Test Symposium, 2024

Test and Repair Improvements for UCIe.
Proceedings of the IEEE European Test Symposium, 2024

New Standard-under-Development for Chiplet Interconnect Test and Repair: IEEE Std P3405.
Proceedings of the IEEE European Test Symposium, 2024

2023
Effective and Efficient Testing of Large Numbers of Inter-Die Interconnects in Chiplet-Based Multi-Die Packages.
Proceedings of the 41st IEEE VLSI Test Symposium, 2023

Generating Test Patterns for Chiplet Interconnects: Achieving Optimal Effectiveness and Efficiency.
Proceedings of the IEEE International Test Conference in Asia, 2023

Effective and Efficient Test and Diagnosis Pattern Generation for Many Inter-Die Interconnects in Chiplet-Based Packages.
Proceedings of the IEEE International 3D Systems Integration Conference, 2023

2022
A Thermal Quorum Sensing Scheme for Enhancement of Integrated-Circuit Reliability and Lifetime.
Proceedings of the 2022 International Symposium on VLSI Design, Automation and Test, 2022

2020
A Power-Efficient Binary-Weight Spiking Neural Network Architecture for Real-Time Object Classification.
CoRR, 2020

A 90nm 103.14 TOPS/W Binary-Weight Spiking Neural Network CMOS ASIC for Real-Time Object Classification.
Proceedings of the 57th ACM/IEEE Design Automation Conference, 2020

2018
Covering hard-to-detect defects by thermal quorum sensing.
Proceedings of the 23rd IEEE European Test Symposium, 2018

2017
Cell-aware test generation time reduction by using switch-level ATPG.
Proceedings of the International Test Conference in Asia, 2017

2016
Efficient Cell-Aware Fault Modeling by Switch-Level Test Generation.
Proceedings of the 25th IEEE Asian Test Symposium, 2016


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