Pin-Cheng Kuo

According to our database, Pin-Cheng Kuo authored at least 5 papers between 2020 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Design Consideration, Numerical and Experimental Analyses of Mode-Division-Multiplexed (MDM) Silicon Photonics Integrated Circuit with Sharp Bends.

Pin-Cheng Kuo, Chi-Wai Chow, Yuan-Zeng Lin, Wahyu Hendra Gunawan, Tun-Yao Hung, Yin-He Jian, Guan-Hong Chen, Ching-Wei Peng, Yang Liu, Chien-Hung Yeh

Sensors, March, 2023

Wideband and Channel Switchable Mode Division Multiplexing (MDM) Optical Power Divider Supporting 7.682 Tbit/s for On-Chip Optical Interconnects.

Tun-Yao Hung, Guan-Hong Chen, Yuan-Zeng Lin, Chi-Wai Chow, Yin-He Jian, Pin-Cheng Kuo, Ching-Wei Peng, Jui-Feng Tsai, Yang Liu, Chien-Hung Yeh

Sensors, January, 2023

2022

Actively Steerable Integrated Optical Phased Array (OPA) for Optical Wireless Communication (OWC).

Pin-Cheng Kuo, Sheng-I Kuo, Ju-Wei Wang, Yin-He Jian, Zohauddin Ahmad, Po-Han Fu, You-Chia Chang, Jin-Wei Shi, Ding-Wei Huang, Yang Liu, Chien-Hung Yeh, Chi-Wai Chow

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

2021

4.36 Tbit/s Silicon Chip-to-Chip Transmission via Few-Mode Fiber (FMF) using 2D Sub-wavelength Grating Couplers.

Pin-Cheng Kuo, Yeyu Tong, Chi-Wai Chow, Jui-Feng Tsai, Yang Liu, You-Chia Chang, Chien-Hung Yeh, Hon Ki Tsang

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

2020

Compact Mode Division MUX/DEMUX Using Enhanced Evanescent-Wave Coupling on Silicon-on-Insulator (SOI) Platform for 11-Tbit/s Broadband Transmission.

Guan-Hong Chen, Jui-Feng Tsai, Ching-Wei Peng, Pin-Cheng Kuo, Chun-Jui Chen, Chi-Wai Chow, Chien-Hung Yeh, Yinchieh Lai, Yang Liu

IEEE Access, 2020