Pieter Bex

According to our database, Pieter Bex authored at least 5 papers between 2011 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Highly Optimized O-band Si Ring Modulators for Low-Power Hybrid CMOS-SiPho Transceivers.

Yoojin Ban, Minkyu Kim, Peter De Heyn, Davide Guermandi, Filippo Ferraro, Natarajan Rajasekaran, Peter Verheyen, Pieter Bex, Junwen He, Hakim Kobbi, Jeroen De Coster, Rafal Magdziak, Dieter Bode, Sebastien Lardenois, Nicolas Pantano, Dimitrios Velenis, Joris Van Campenhout

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

2022

(Why do we need) Wireless Heterogeneous Integration (anyway?).

Michaël Peeters, S. Sinha, Xiao Sun, Claude Desset, Giuseppe Gramegna, John Slabbekoorn, Pieter Bex, Nelson Pinho, Tomas Webers, Dimitrios Velenis, Andy Miller, Nadine Collaert, Geert Van der Plas, Eric Beyne, M. Huynen, R. Broucke

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2019

Process Complexity and Cost Considerations of Multi-Layer Die Stacks.

Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Die to wafer 3D stacking for below 10um pitch microbumps.

Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2011

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011