Philippe Descamps

According to our database, Philippe Descamps authored at least 16 papers between 2002 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2024

A 26-28 GHz, Two-Stage, Low-Noise Amplifier for Fifth-Generation Radio Frequency and Millimeter-Wave Applications.

Aymen Ben Hammadi, Mohamed Aziz Doukkali, Philippe Descamps, Constant Niamien

Sensors, April, 2024

2019

Applied TRL Calibration Method to Differential Devices Embedded in a Test Board.

Kassem Hamze, Daniel Pasquet, Philippe Descamps, Edouard De Ledinghen

Proceedings of the IEEE Radio and Wireless Symposium, 2019

2017

Simulation and analysis of DC and RF performances degradation of NMOS transistors under hot carrier injection mechanism.

Insaf Lahbib, Aziz Doukkali, Patrick Martin, Philippe Descamps, Guy Imbert

Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017

2016

An Experience of Engineering of MAS for Smart Environments: Extension of ASPECS.

Philippe Descamps, Vincent Hilaire, Olivier Lamotte, Sebastian Rodriguez

Proceedings of the Intelligent Interactive Multimedia Systems and Services 2016, 2016

2015

Multi-Agent System for intelligent Scrum project management.

Yishuai Lin, Philippe Descamps, Nicolas Gaud, Vincent Hilaire, Abderrafiaa Koukam

Integr. Comput. Aided Eng., 2015

An Analysis and Prototyping Approach for Cyber-Physical Systems.

Samuel Deniaud, Philippe Descamps, Vincent Hilaire, Olivier Lamotte, Sebastian Rodriguez

Proceedings of the 10th International Conference on Future Networks and Communications (FNC 2015) / The 12th International Conference on Mobile Systems and Pervasive Computing (MobiSPC 2015) / Affiliated Workshops, 2015

2013

Reducing substrate noise coupling in a 3D-PICS Integrated Passive Device by localized P+ guard rings.

Miled Ben Salah, Daniel Pasquet, Frederic Voiron, Philippe Descamps, Jean Luc Lefebvre, Dominique Lesenechal

Proceedings of the 2013 IEEE Radio and Wireless Symposium, 2013

2012

Influence of the output harmonic networks of classes F and F^-1 power amplifiers in LINC systems.

Ronald Montesinos, Corinne Berland, Mazen Abi-Hussein, Olivier Venard, Philippe Descamps

Proceedings of the 10th IEEE International NEWCAS Conference, 2012

Performances of RF PA classes in LINC systems.

Ronald Montesinos, Corinne Berland, Mazen Abi-Hussein, Olivier Venard, Philippe Descamps

Proceedings of the 2012 IEEE International Symposium on Circuits and Systems, 2012

2008

Determination of temperature change inside IC packages during laser ablation of molding compound.

P. Schwindenhammer, H. Murray, Philippe Descamps, Patrick Poirier

Microelectron. Reliab., 2008

2005

Isolating failing sites in IC packages using time domain reflectometry: Case studies.

Dolphin Abessolo-Bidzo, Patrick Poirier, Philippe Descamps, Bernadette Domengès

Microelectron. Reliab., 2005

2004

Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems.

Olivier Crépel, Patrick Poirier, Philippe Descamps, Romain Desplats, Philippe Perdu, Gérald Haller, Abdellatif Firiti

Microelectron. Reliab., 2004

Study and validation of a power-rail ESD clamp in BiCMOS process with a reduced temperature dependency of its leakage current.

F. Barbier, Fabrice Blanc, A. Le Grontec, R. Colclaser, Theo Smedes, M. Johnson, Serge Bardy, Philippe Descamps

Microelectron. Reliab., 2004

2003

Magnetic emission mapping for passive integrated components characterisation.

Olivier Crépel, Romain Desplats, Y. Bouttement, Philippe Perdu, C. Goupil, Philippe Descamps, Felix Beaudoin, L. Marina

Microelectron. Reliab., 2003

2002

Comprehensive failure analysis of leakage faults in bipolar transistors.

Bernadette Domengès, P. Schwindenhammer, Patrick Poirier, Felix Beaudoin, Philippe Descamps

Microelectron. Reliab., 2002

Magnetic field measurements for Non Destructive Failure Analysis.

Olivier Crépel, C. Goupil, Bernadette Domengès, Philippe Descamps, Philippe Perdu, A. Doukkali

Microelectron. Reliab., 2002