Philip Jacob

According to our database, Philip Jacob authored at least 11 papers between 2005 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU.

Ryan Clarke, Philip Jacob, Okan Erdogan, Paul Belemijian, Srikumar Raman, Mitchell R. LeRoy, Tuhin Guha Neogi, Russell P. Kraft, Diana-Andra Borca-Tasciuc, John F. McDonald

IEEE Access, 2015

2011

Carry Chains for Ultra High-Speed SiGe HBT Adders.

Alexey Gutin, Philip Jacob, Michael Chu, Paul M. Belemjian, Mitchell R. LeRoy, Russell P. Kraft, John F. McDonald

IEEE Trans. Circuits Syst. I Regul. Pap., 2011

Reconfigurable 40 GHz BiCMOS uniform delay crossbar switch for broadband and wide tuning range narrowband applications.

Jin Woo Kim, Michael Chu, Philip Jacob, Aamir Zia, Russell P. Kraft, John F. McDonald

IET Circuits Devices Syst., 2011

2010

Serial code accelerators for heterogeneous multi-core processor with 3D stacked memory.

Philip Jacob

PhD thesis, 2010

A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration.

Aamir Zia, Philip Jacob, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald

IEEE Trans. Very Large Scale Integr. Syst., 2010

Correction to "A 40 GS/s Time Interleaved ADC Using SiGe BiCMOS Technology".

Michael Chu, Philip Jacob, Jin Woo Kim, Mitchell R. LeRoy, Russell P. Kraft, John F. McDonald

IEEE J. Solid State Circuits, 2010

A 40 Gs/s Time Interleaved ADC Using SiGe BiCMOS Technology.

Michael Chu, Philip Jacob, Jin Woo Kim, Mitchell R. LeRoy, Russell P. Kraft, John F. McDonald

IEEE J. Solid State Circuits, 2010

2009

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks.

Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald, Kerry Bernstein

Proc. IEEE, 2009

Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.

John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007

Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.

Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald

Proceedings of the 25th International Conference on Computer Design, 2007

2005

Predicting the Performance of a 3D Processor-Memory Chip Stack.

Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald

IEEE Des. Test Comput., 2005