Philip Jacob

Affiliations:
  • IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
  • Rensselaer Polytechnic Institute, USA (PhD 2010)


According to our database1, Philip Jacob authored at least 3 papers between 2007 and 2010.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2010
Serial code accelerators for heterogeneous multi-core processor with 3D stacked memory.
PhD thesis, 2010

2009
Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007
Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.
Proceedings of the 25th International Conference on Computer Design, 2007


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