Peter Kjær Kristensen

According to our database, Peter Kjær Kristensen authored at least 5 papers between 2013 and 2018.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2018

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates.

Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok

Microelectron. Reliab., 2018

2016

Comprehensive physical analysis of bond wire interfaces in power modules.

Vladimir N. Popok, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Kjeld Pedersen

Microelectron. Reliab., 2016

Mechanisms of metallization degradation in high power diodes.

Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir N. Popok

Microelectron. Reliab., 2016

2015

Effects of thermal cycling on aluminum metallization of power diodes.

Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok

Microelectron. Reliab., 2015

2013

Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules.

Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok, Kjeld Pedersen

Microelectron. Reliab., 2013