Peter J. Brofman

According to our database, Peter J. Brofman authored at least 3 papers between 1992 and 2005.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2005

Effects of mechanical stress and moisture on packaging interfaces.

Stephen L. Buchwalter, Peter J. Brofman, Claudius Feger, Michael A. Gaynes, Kang-Wook Lee, Luis J. Matienzo, David L. Questad

IBM J. Res. Dev., 2005

2002

An advanced multichip module (MCM) for high-performance UNIX servers.

John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth

IBM J. Res. Dev., 2002

1992

Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors.

Peter J. Brofman, Sudipta K. Ray, Keith F. Beckham

IBM J. Res. Dev., 1992