Peter Alpern

According to our database, Peter Alpern authored at least 2 papers between 2004 and 2005.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2005

A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages.

Kheng Chooi Lee, A. Vythilingam, Peter Alpern

Microelectron. Reliab., 2005

2004

Effect of long and short Pb-free soldering profiles of IPC/JEDEC J-STD-020 on plastic SMD packages.

Peter Alpern, Kheng Chooi Lee, Rainer Tilgner

Microelectron. Reliab., 2004