Per-Erik Tegehall

According to our database, Per-Erik Tegehall authored at least 2 papers between 2007 and 2015.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2015

Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints.

Per-Erik Tegehall, Göran Wetter

Microelectron. Reliab., 2015

2007

Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints.

C. Andersson, D. R. Andersson, Per-Erik Tegehall, Johan Liu

Microelectron. Reliab., 2007