Peng-Shu Chen

According to our database, Peng-Shu Chen authored at least 2 papers between 2011 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.

Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011