Peng-Fei Fu

According to our database, Peng-Fei Fu authored at least 1 paper in 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2013

Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.

Yann Civale, Herman Meynen, Ranjith S. E. John, Peng-Fei Fu, Craig R. Yeakle, Sheng Wang, Stefan Krausse, Thomas Rapps, Stefan Lutter

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013