Pay Jun Liew

According to our database, Pay Jun Liew authored at least 1 paper in 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2013

Fabrication of Microstructures on RB-SiC by Ultrasonic Cavitation Assisted Micro-Electrical Discharge Machining.

Pay Jun Liew, Keita Shimada, Masayoshi Mizutani, Jiwang Yan, Tsunemoto Kuriyagawa

Int. J. Autom. Technol., 2013