Paul-Vahe Cicek
Orcid: 0000-0002-3665-0721Affiliations:
- Université du Québec à Montréal, UQÁM, Department of Computer Sciences, Canada
- McGill University, Montreal, Canada
According to our database1,
Paul-Vahe Cicek
authored at least 14 papers
between 2008 and 2024.
Collaborative distances:
Collaborative distances:
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Online presence:
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on orcid.org
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Bibliography
2024
A Rail-to-Rail Low-Power Dynamic CMOS Amplifier for Switched-Capacitor Filters in High-Performance ADC.
Proceedings of the 67th IEEE International Midwest Symposium on Circuits and Systems, 2024
2023
Proceedings of the 30th IEEE International Conference on Electronics, Circuits and Systems, 2023
2022
A Study of Optimizing Lamb Wave Acoustic Mass Sensors' Performance through Adjustment of the Transduction Electrode Metallization Ratio.
Sensors, 2022
Proceedings of the 20th IEEE Interregional NEWCAS Conference, 2022
2021
A System in Package Based on a Piezoelectric Micromachined Ultrasonic Transducer Matrix for Ranging Applications.
Sensors, 2021
A Simple, Versatile Integration Platform based on a Printed Circuit Board for Lab-on-a-Chip Systems.
Proceedings of the 28th IEEE International Conference on Electronics, 2021
2013
A 0.13-µm CMOS Interface Circuit for a MEMS Resonator-Based Vacuum Measurement System.
IEEE Trans. Circuits Syst. I Regul. Pap., 2013
Ultra low-power low-noise transimpedance amplifier for MEMS-based reference oscillators.
Proceedings of the 20th IEEE International Conference on Electronics, 2013
2010
A MEMS-based temperature-compensated vacuum sensor for low-power monolithic integration.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2010), May 30, 2010
2009
IEEE J. Solid State Circuits, 2009
Proceedings of the 16th IEEE International Conference on Electronics, 2009
Proceedings of the 16th IEEE International Conference on Electronics, 2009
2008
MEMS wafer-level vacuum packaging with transverse interconnects for CMOS integration.
Proceedings of the IEEE 2008 Custom Integrated Circuits Conference, 2008