Paul S. Ho

According to our database, Paul S. Ho authored at least 8 papers between 2002 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2020

Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips.

Weishen Chu, Laura Spinella, Dwayne R. Shirley, Paul S. Ho

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2013

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias.

Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Rui Huang, Paul S. Ho

Microelectron. Reliab., 2013

2009

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints.

Brook Huang-Lin Chao, Xuefeng Zhang, Seung-Hyun Chae, Paul S. Ho

Microelectron. Reliab., 2009

2005

Chip-packaging interaction: a critical concern for Cu/low k packaging.

Guotao Wang, Paul S. Ho, Steven Groothuis

Microelectron. Reliab., 2005

A two-chip, 4-MHz, microelectromechanical reference oscillator.

Krishnakumar Sundaresan, Paul S. Ho, Siavash Pourkamali, Farrokh Ayazi

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005

2004

Reliability issues for flip-chip packages.

Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai

Microelectron. Reliab., 2004

2002

Electromigration reliability issues in dual-damascene Cu interconnections.

Ennis T. Ogawa, Ki-Don Lee, Volker A. Blaschke, Paul S. Ho

IEEE Trans. Reliab., 2002

Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures.

Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho

Microelectron. Reliab., 2002