Paul M. Belemjian

According to our database, Paul M. Belemjian authored at least 7 papers between 2003 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2011

Carry Chains for Ultra High-Speed SiGe HBT Adders.

Alexey Gutin, Philip Jacob, Michael Chu, Paul M. Belemjian, Mitchell R. LeRoy, Russell P. Kraft, John F. McDonald

IEEE Trans. Circuits Syst. I Regul. Pap., 2011

2009

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks.

Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald, Kerry Bernstein

Proc. IEEE, 2009

Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.

John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007

Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.

Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald

Proceedings of the 25th International Conference on Computer Design, 2007

2005

SiGe HBT Microprocessor Core Test Vehicle.

Paul M. Belemjian, Okan Erdogan, Russell P. Kraft, John F. McDonald

Proc. IEEE, 2005

Predicting the Performance of a 3D Processor-Memory Chip Stack.

Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald

IEEE Des. Test Comput., 2005

2003

3D direct vertical interconnect microprocessors test vehicle.

John Mayega, Okan Erdogan, Paul M. Belemjian, Kuan Zhou, John F. McDonald, Russell P. Kraft

Proceedings of the 13th ACM Great Lakes Symposium on VLSI 2003, 2003