Patrick Verdonck

According to our database, Patrick Verdonck authored at least 2 papers between 2015 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.

Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2015

Impact of oxide liner properties on TSV Cu pumping and TSV stress.

Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2015