Patrick Leduc
According to our database1,
Patrick Leduc
authored at least 9 papers
between 2009 and 2013.
Collaborative distances:
Collaborative distances:
Timeline
2009
2010
2011
2012
2013
0
1
2
3
4
5
1
1
3
1
3
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2013
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.
Microelectron. Reliab., 2013
Proceedings of the Design, Automation and Test in Europe, 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2010
A successful implementation of dual damascene architecture to copper TSV for 3D high density applications.
Proceedings of the IEEE International Conference on 3D System Integration, 2010
2009
Proceedings of the IEEE International Conference on 3D System Integration, 2009
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.
Proceedings of the IEEE International Conference on 3D System Integration, 2009