Patrick Le Maitre

According to our database, Patrick Le Maitre authored at least 5 papers between 2012 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Silicon Photonics Platform from Datacom to Sensing Applications.

Frédéric Boeuf, Cyrille Barrera, Ismael Charlet, Michele Calvo, Antonio Fincato, Stéphane Monfray, Sylvain Guerber, Sebastien Cremer, Nathalie Vulliet, Jean Francois Carpentier, Luca Maggi, Daivid Fowler, Christophe Jany, Patrick Le Maitre, Maurin Douix, Régis Orobtchouk, Delphine Marris-Morini, Laurent Vivien

Proceedings of the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium, 2021

2015

Recent progress in Silicon Photonics R&D and manufacturing on 300mm wafer platform.

Frédéric Boeuf, Sebastien Cremer, Enrico Temporiti, Massimo Fere, Mark Shaw, Nathalie Vulliet, Bastien Orlando, Delia Ristoiu, Alexis Farcy, Thierry Pinguet, Attila Mekis, Gianlorenzo Masini, Peng Sun, Yuemeng Chi, Herve Petiton, Sebastien Jan, Jean-Robert Manouvrier, Charles Baudot, Patrick Le Maitre, Jean Francois Carpentier, Laurent Salager, Matteo Traldi, Luca Maggi, Danilo Rigamonti, Chiara Zaccherini, Carolina Elemi, Bernard Sautreuil, Luigi Verga

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2015

Impact of process variability of active ring resonators in a 300mm silicon photonic platform.

Patrick Le Maitre, Jean Francois Carpentier, Charles Baudot, Nathalie Vulliet, Aurelie Souhaite, Jean-Baptiste Quelene, Thomas Ferrotti, Frédéric Boeuf

Proceedings of the European Conference on Optical Communication, 2015

2013

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits.

Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix.

Patrick Le Maitre, Melanie Brocard, Alexis Farcy, Jean-Claude Marin

Proceedings of the Thirteenth International Symposium on Quality Electronic Design, 2012