Patrick Justison

According to our database, Patrick Justison authored at least 9 papers between 2015 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal.

Zhuo-Jie Wu, Ping-Chuan Wang, Seungman Choi, Patrick Justison, Martin Gall, Jae Kyu Cho, Takako Hirokawa, Yusheng Bian, Thomas Houghton, Vaishnavi Karra, Dan Moy, Karen Nummy, Dave Riggs, Norman Robson, Ian Melville, Ken Giewont

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

2019

Novel Oxide Top-Off Process Enabling Reliable PC-CA TDDB on IO Devices with Self Aligned Contact.

Tian Shen, Abu Naser Zainuddin, Purushothaman Srinivasan, Zakariae Chbili, Kai Zhao, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2019

A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer.

C. S. Premachandran, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

New insight on TDDB area scaling methodology of non-Poisson systems.

Tian Shen, Kong Boon Yeap, Sean P. Ogden, Cathryn Christiansen, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Reliability challenges for 2.5D/3D integration: An overview.

C. S. Premachandran, Seungman Choi, Salvatore Cimino, Thuy Tran-Quinn, Lloyd Burrell, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Effect of metal line width on electromigration of BEOL Cu interconnects.

Seungman Choi, Cathryn Christiansen, Linjun Cao, James Zhang, Ronald Filippi, Tian Shen, Kong Boon Yeap, Sean P. Ogden, Haojun Zhang, Bianzhu Fu, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2015

An investigation of process dependence of porous IMD TDDB.

Wenyi Zhang, M. C. Silvestre, A. Selvam, E. Ramanathan, C. Ordonio, J. Schaller, Tian Shen, Kong Boon Yeap, C. Capasso, Patrick Justison, J. H. Lee

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of electrode surface modulation on time-dependent dielectric breakdown.

Kong Boon Yeap, Tian Shen, Galor Wenyi Zhang, Sing Fui Yap, Brian Holt, Arfa Gondal, Seungman Choi, San Leong Liew, Walter Yao, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2015

An investigation of dielectric thickness scaling on BEOL TDDB.

Tian Shen, Wenyi Zhang, Kong Boon Yeap, Jing Tan, Walter Yao, Patrick Justison

Proceedings of the IEEE International Reliability Physics Symposium, 2015