Patrick J. McNally
Orcid: 0000-0003-2798-5121
According to our database1,
Patrick J. McNally
authored at least 2 papers
between 2006 and 2016.
Collaborative distances:
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Bibliography
2016
B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages.
Microelectron. Reliab., 2016
2006
The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography.
Microelectron. J., 2006