Pascal Chausse

According to our database, Pascal Chausse authored at least 5 papers between 2009 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

Thermo-mechanical characterization of passive stress sensors in Si interposer.

Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas

Microelectron. Reliab., 2015

Stress management strategy to limit die curvature during silicon interposer integration.

Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stephanie Escoubas, Olivier Thomas

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.

Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments.

Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2009

3D integration technology for set-top box application.

David Henry, Séverine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier

Proceedings of the IEEE International Conference on 3D System Integration, 2009