Paras R. Patel

Orcid: 0000-0001-6146-718X

According to our database1, Paras R. Patel authored at least 10 papers between 2016 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
A Sub-mm<sup>3</sup> Wireless Neural Stimulator IC for Visual Cortical Prosthesis With Optical Power Harvesting and 7.5-kb/s Data Telemetry.
IEEE J. Solid State Circuits, April, 2024

2023
A Wireless Neural Stimulator IC for Cortical Visual Prosthesis.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Intraretinal stimulation with high density carbon fiber microelectrodes.
Proceedings of the 11th International IEEE/EMBS Conference on Neural Engineering, 2023

2022
A Light-Tolerant Wireless Neural Recording IC for Motor Prediction With Near-Infrared-Based Power and Data Telemetry.
IEEE J. Solid State Circuits, 2022

A 260×274 μm<sup>2</sup> 572 nW Neural Recording Micromote Using Near-Infrared Power Transfer and an RF Data Uplink.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2021
A Light Tolerant Neural Recording IC for Near-Infrared-Powered Free Floating Motes.
Proceedings of the 2021 Symposium on VLSI Circuits, Kyoto, Japan, June 13-19, 2021, 2021

2020
Bending Properties of Materials for Peripheral Nerve Interfaces.
Proceedings of the 15th IEEE International Conference on Nano/Micro Engineered and Molecular System, 2020

26.9 A 0.19×0.17mm<sup>2</sup> Wireless Neural Recording IC for Motor Prediction with Near-Infrared-Based Power and Data Telemetry.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2019
Microneedle Penetrating Array with Axon-Sized Dimensions for Cuff-less Peripheral Nerve Interfacing.
Proceedings of the 2019 9th International IEEE/EMBS Conference on Neural Engineering (NER), 2019

2016
Effects of geometry and material on the insertion oi very small neural electrode.
Proceedings of the 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2016


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