Papa Momar Souare

According to our database, Papa Momar Souare authored at least 3 papers between 2013 and 2016.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2016

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy

IEEE Des. Test, 2016

2014

Using TSVs for thermal mitigation in 3D circuits: Wish and truth.

Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Thermal correlation between measurements and FEM simulations in 3D ICs.

Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013