P. Jaenen

According to our database, P. Jaenen authored at least 2 papers between 2005 and 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.

Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2005

Implementation of high-k and metal gate materials for the 45nm node and beyond: gate patterning development.

S. Beckx, M. Demand, S. Locorotondo, K. Henson, M. Claes, V. Paraschiv, D. Shamiryan, P. Jaenen, W. Boullart, S. Degendt

Microelectron. Reliab., 2005