P. D. Foo

According to our database, P. D. Foo authored at least 2 papers in 2003.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2003

Investigation of defect on copper bond pad surface in copper/low k process integration.

Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo

Microelectron. Reliab., 2003

Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration.

Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo

Microelectron. J., 2003