Ong Tee Say

According to our database, Ong Tee Say authored at least 4 papers in 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of six.

2013

Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball.

Zaliman Sauli, Vithyacharan Retnasamy, Ong Tee Say, Steven Taniselass, Rizalafande Che Ismail, Aaron Koay Terr Yeow, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method.

Zaliman Sauli, Vithyacharan Retnasamy, Muhamad Hafiz Ab Aziz, Ong Tee Say, Hussin Kamarudin, Dasarathan Rajan Theren, Bahari Man

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder.

Vithyacharan Retnasamy, Zaliman Sauli, Nurul Izza Mohd Nor, Moganraj Palianysamy, Rizalafande Che Ismail, Ong Tee Say, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED.

Rajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Phaklen EhKan, Ong Tee Say

Proceedings of the Asia Modelling Symposium 2013, 2013