Olli Nousiainen

According to our database, Olli Nousiainen authored at least 4 papers between 2001 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors.

Jussi Putaala, Jari Hannu, Esa Kunnari, Matti Mäntysalo, Olli Nousiainen, Heli Jantunen

Microelectron. Reliab., 2014

2008

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies.

Olli Nousiainen, L. Lehtiniemi, T. Kangasvieri, Risto Rautioaho, J. Vähäkangas

Microelectron. Reliab., 2008

2006

Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies.

T. Kangasvieri, Olli Nousiainen, Jussi Putaala, Risto Rautioaho, J. Vähäkangas

Microelectron. Reliab., 2006

2001

Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules.

Risto Rautioaho, Olli Nousiainen, Seppo Leppävuori, Jaakko Lenkkeri, Tuomo Jaakola

Microelectron. Reliab., 2001